Encapsulated material with controlled release

G.E.T. van Vilsteren; H.J. Neerhof; E.P.H.M. Schijvens; D.A.P. Delnoye; T. Jongsma

Encapsulated material with controlled release

G.E.T. van Vilsteren (Inventor), H.J. Neerhof (Inventor), E.P.H.M. Schijvens (Inventor), D.A.P. Delnoye (Inventor), T. Jongsma (Inventor)

Research output: Patent

Abstract

An encapsulated material is described of which at least a part of the material is kept encapsulated during heat treatment in an aqueous environment and is released during cooling after a heat treatment. The material is encapsulated in a layer of a hydrophobic film-forming material and a layer of a material having a low critical solution temperature (LCST) below the treatment temperature. The layer containing the hydrophobic material may be situated inside the layer having the LCST and have a melting point below the LCST, but it may also be situated outside the layer having the LCST and have a melting point above the LCST of said layer. Said layers may also be applied together.

Original language	English
Patent number	WO9849910
Priority date	1/05/97
Publication status	Published - 12 Nov 1998

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title = "Encapsulated material with controlled release",

abstract = "An encapsulated material is described of which at least a part of the material is kept encapsulated during heat treatment in an aqueous environment and is released during cooling after a heat treatment. The material is encapsulated in a layer of a hydrophobic film-forming material and a layer of a material having a low critical solution temperature (LCST) below the treatment temperature. The layer containing the hydrophobic material may be situated inside the layer having the LCST and have a melting point below the LCST, but it may also be situated outside the layer having the LCST and have a melting point above the LCST of said layer. Said layers may also be applied together.",

author = "{van Vilsteren}, G.E.T. and H.J. Neerhof and E.P.H.M. Schijvens and D.A.P. Delnoye and T. Jongsma",

year = "1998",

month = nov,

day = "12",

language = "English",

type = "Patent",

note = "WO9849910",

}

TY - PAT

T1 - Encapsulated material with controlled release

AU - van Vilsteren, G.E.T.

AU - Neerhof, H.J.

AU - Schijvens, E.P.H.M.

AU - Delnoye, D.A.P.

AU - Jongsma, T.

PY - 1998/11/12

Y1 - 1998/11/12

N2 - An encapsulated material is described of which at least a part of the material is kept encapsulated during heat treatment in an aqueous environment and is released during cooling after a heat treatment. The material is encapsulated in a layer of a hydrophobic film-forming material and a layer of a material having a low critical solution temperature (LCST) below the treatment temperature. The layer containing the hydrophobic material may be situated inside the layer having the LCST and have a melting point below the LCST, but it may also be situated outside the layer having the LCST and have a melting point above the LCST of said layer. Said layers may also be applied together.

AB - An encapsulated material is described of which at least a part of the material is kept encapsulated during heat treatment in an aqueous environment and is released during cooling after a heat treatment. The material is encapsulated in a layer of a hydrophobic film-forming material and a layer of a material having a low critical solution temperature (LCST) below the treatment temperature. The layer containing the hydrophobic material may be situated inside the layer having the LCST and have a melting point below the LCST, but it may also be situated outside the layer having the LCST and have a melting point above the LCST of said layer. Said layers may also be applied together.

M3 - Patent

M1 - WO9849910

ER -

Encapsulated material with controlled release

Abstract

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