Encapsulated material with controlled release

G.E.T. van Vilsteren (Inventor), H.J. Neerhof (Inventor), E.P.H.M. Schijvens (Inventor), D.A.P. Delnoye (Inventor), T. Jongsma (Inventor)

    Research output: PatentOther research output


    An encapsulated material is described of which at least a part of the material is kept encapsulated during heat treatment in an aqueous environment and is released during cooling after a heat treatment. The material is encapsulated in a layer of a hydrophobic film-forming material and a layer of a material having a low critical solution temperature (LCST) below the treatment temperature. The layer containing the hydrophobic material may be situated inside the layer having the LCST and have a melting point below the LCST, but it may also be situated outside the layer having the LCST and have a melting point above the LCST of said layer. Said layers may also be applied together.
    Original languageEnglish
    Patent numberWO9849910
    Priority date1/05/97
    Publication statusPublished - 12 Nov 1998

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