An encapsulated material is described of which at least a part of the material is kept encapsulated during heat treatment in an aqueous environment and is released during cooling after a heat treatment. The material is encapsulated in a layer of a hydrophobic film-forming material and a layer of a material having a low critical solution temperature (LCST) below the treatment temperature. The layer containing the hydrophobic material may be situated inside the layer having the LCST and have a melting point below the LCST, but it may also be situated outside the layer having the LCST and have a melting point above the LCST of said layer. Said layers may also be applied together.
|Publication status||Published - 12 Nov 1998|
van Vilsteren, G. E. T., Neerhof, H. J., Schijvens, E. P. H. M., Delnoye, D. A. P., & Jongsma, T. (1998). Encapsulated material with controlled release. (Patent No. WO9849910). https://worldwide.espacenet.com/publicationDetails/originalDocument?CC=WO&NR=9849910A1&KC=A1&FT=D&ND=3&date=19981112&DB=EPODOC&locale=en_EP